Fabricación por Diffusion Bonding de Agrupaciones de Antenas en Guía de Onda para Banda W

TitleFabricación por Diffusion Bonding de Agrupaciones de Antenas en Guía de Onda para Banda W
Publication TypeConference Paper
Year of Publication2018
AuthorsGarcia-Marin, E., J. L. Masa-Campos, and P. Sanchez-Olivares
Conference NameSimposium Nacional URSI 2018
Date PublishedSeptember
AbstractMillimeter-wave radiating systems appear attractive for radiofrequency applications like radio-positioning or telecommunications. High-gain array antennas can be implemented in reduced-size devices in this part of the frequency spectrum. Waveguide implementations seem indispensable to mitigate the dissipation losses inherent to these frequencies. Nevertheless, the implementation of multilayer waveguide array antennas is a challenge. Electrical contact between the antenna layers must be guaranteed to prevent power leakage, which is ensured only in part with mechanical tightening. Additive manufactured antenna arrays provide electrical continuity, although dimensional accuracy diminishes and dissipation losses increase owing to surface roughness and reduced conductivity. In this context, diffusion bonding allows complex multilayer designs by joining accurately-etched metallic sheets without additional sticking or tightening material. A corporate-fed waveguide antenna array is presented in this paper to experimentally validate this manufacturing technique for W-band implementations.